CPU cooling arrangement
US6343014B1 · kind B1 · utility
30Cited by
10References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 11, 2000 |
| Grant date | Jan 29, 2002 |
| Priority date | — |
| Expiry date | Aug 11, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A CPU cooling arrangement includes a heat sink adapted to receive heat from the CPU of a computer, and a plurality of fans arranged in a stack on the heat sink and adapted to draw outside cold air toward the heat sink for quick dissipation of heat from the heat, the fans being connected in series and spaced from one another by spacer means thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.