Memory module
US6343020B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1999 |
| Grant date | Jan 29, 2002 |
| Priority date | — |
| Expiry date | Jul 19, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C5/04
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory module includes a circuit board on which memory chips are mounted and a metal casing attached to the circuit board for shielding the memory chips. Conductive traces are formed on the circuit board for electrically engaging corresponding portions of the casing to ground the casing. The casing forms a raised portion defining a space for accommodating the memory chips. A recess is formed on the raised portion and a bottom surface of the recess contacts the memory chips to conduct and remove heat from the memory chips. Ventilation holes are defined in the raised portion for facilitating heat removal. The casing forms two positioning pins inserted into corresponding positioning holes defined in the circuit board for properly positioning the casing with respect to the circuit board. The casing also forms two latching arms engaging with corresponding latching holes defined in the circuit board for securing the casing to the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.