Method and device for full thickness resectioning of an organ
US6343731B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2001 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | Mar 22, 2021 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2090/306
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A full-thickness resection system comprises a flexible endoscope and a stapling mechanism, wherein the endoscope is slidably received through at least a portion of the stapling mechanism. The stapling mechanism comprises an anvil and a stapling head mounted to the anvil so that the anvil and the stapling head are moveable with respect to one another between a tissue receiving position and a stapling position and wherein a gap formed between the stapling head and the anvil is larger in the tissue receiving position than it is in the stapling position. A position adjusting mechanism is provided for moving the anvil and the stapling head between the tissue receiving and stapling positions and a staple firing mechanism sequentially fires a plurality of staples from the stapling head across the gap against the anvil and through any tissue received in the gap and a knife cuts a portion of tissue received within the gap. A control unit which remains outside the body is coupled to the stapling mechanism for controlling operation of the position adjusting mechanism and the staple firing mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.