Device allowing the treatment of a substrate in a machine provided for the treatment of bigger substrates and a system of mounting a substrate in this device
US6343784B1 · kind B1 · utility
28Cited by
16References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 1999 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | Sep 21, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/90
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device that allows the treatment of a substrate in a machine provided for the treatment of bigger substrates and a mounting system for a substrate in this device.The device comprises a ring (24) having an external diameter equal to the diameter of these substrates, this ring being capable of setting the substrate (22) of smaller diameter. The system includes means (34) of manipulating this substrate and means (36) of heating the ring or of cooling this substrate. Application in micro-electronics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.