Chemical-mechanical polishing apparatus with circular motion pads
US6343975B1 · kind B1 · utility
Inventor
Key dates
| Filing date | Oct 5, 1999 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | Oct 5, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/34
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus provide polishing of a semiconductor wafer or other substrate. The apparatus includes multiple wafer carriers provided on the top surface of a table. A semiconductor wafer is seated face-up in the wafer carrier. Each wafer carrier is driven by an electric motor to rotate at a low speed. During operation, each wafer carrier is positioned at a work station where a specified task is performed. The table rotates when the task at each station is completed to move the wafers from station to station. Thus multiple tasks relating to polishing (e.g., buffing and drying) can be carried out in parallel. At one station, a polishing pad is positioned by a polishing pad carrier face-down to polish the surface of the semiconductor wafer. A motor drives the polishing pad to move in a high-speed circular motion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.