Apparatus, and corresponding method, for chemically etching substrates
US6344106B1 · kind B1 · utility
2Cited by
132References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2000 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | Aug 2, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0085
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus, and a corresponding method, for chemically etching the copper foil of a copper foil-clad substrate are disclosed. Significantly, this apparatus includes fluid jet injectors which serve to produce jets of chemical etchant. These fluid jet injectors are arranged so as to simultaneously achieve a relatively high etch rate and a relatively high etch uniformity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.