Method for aligning optical devices with substrate
US6344148B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1999 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | Nov 5, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4238
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An easy method proposes a passive alignment by using an alignment mark. That is, V-shaped grooves are utilized as alignment marks in place of a metal pattern of the prior art in observing an optical contrast. Also, in order to adjust a height of an optical device, the support made of a metal is formed in the conventional method, whereas in the present invention a height of an optical device is adjusted by etching the silicon substrate and clamped through the use of solder bumps formed in the V-shaped grooves. And also, in this invention, it is possible that V-shaped grooves can be facilely formed on a non-planarized substrate by using a method of burying a mask material during the formation of the V-shaped grooves. By applying the above principle, the present invention proposes a process capable of passive aligning an optical device, a planar lightwave circuit (PLC) and an optical fiber, simultaneously.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.