Electrode material for forming stamper and thin film for forming stamper
US6344275B2 · kind B2 · utility
2Cited by
4References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 14, 2001 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | May 14, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12944
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
To present a material for stamper free from deterioration of stamper quality due to reaction with an electron-attracting radical contained in the resist material. An electrode formed on the surface of a patterned resist film 2 for electrocasting a stamper material is formed of a nickel alloy thin film 3 comprising Ni element as a principal component, and Ru element added in a range of less than 25 percent by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.