Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method
US6344309B2 · kind B2 · utility
20Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1999 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | Oct 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0355
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metal pattern is prepared by applying a polysilane composition comprising a polysilane, a carbon functional silane, and a solvent onto a substrate to form a patterned coating of the polysilane composition, attaching catalytic metal nuclei to the patterned coating, and immersing the substrate in an electroless plating bath for thereby chemically depositing a metal film on the patterned coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.