Power electronic component including cooling means
US6344686B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 1999 |
| Grant date | Feb 5, 2002 |
| Priority date | — |
| Expiry date | Nov 23, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The power electric component comprises first and second heat transfer and electrical insulation composite structures and at least one power semiconductor circuit which has connecting terminals. The first composite structure includes respective conductive or semiconductor layers adjacent to the semiconductor circuit and conductive or semiconductor layers opposite to the semiconductor circuit. The connecting terminals are attached on the side opposite the first composite structure to a plane array of mutually insulated conductive members, wherein the array is integrated into the second composite structure which includes a conductive or semiconductor layer opposite to the semiconductor circuit. The opposite layer of at least the first composite structure or the second composite structure includes flow passages for a heat transfer fluid so that the component can be cooled from its top and bottom faces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.