Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same

US6344973B1 · kind B1 · utility

Assignee

• ALCATEL · FR

Inventors

• Hans-Peter Feustel · Roth, DE
• Friedrich Loskarn · Hirschaid, DE
• Reinhard Rückert · Speicher, DE

Key dates

• Filing date: Jul 13, 1999
• Grant date: Feb 5, 2002
• Expiry date: Jul 13, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

The invention relates to a power module with a circuit arrangement provided with active semiconductor components and passive components and with a circuit substrate, whereby at least a portion of the active semiconductor components are soldered onto a DCB substrate and at least a portion of the passive components are printed in thick film technology on at least one ceramic substrate. The upper side of the DCB substrate is structured to form track conductors and connecting surfaces for receiving the active semiconductor components and passive components of the circuit arrangement. On the ceramic substrate, for each passive component, a first print layer is printed in thick film technology and at least one contact surface as additional print layer laterally adjoining the first print layer. The ceramic substrates for the passive components in thick film technology are connected via the at least one contact surface with the corresponding connecting surface(s) of the DCB substrate by means of a soldered connection.