Surface-mount type emitting diode and method of manufacturing same
US6345903B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2000 |
| Grant date | Feb 12, 2002 |
| Priority date | — |
| Expiry date | Sep 1, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a surface-mount type light emitting diode wherein a reflection frame is placed around a light emitting diode element mounted on an upper surface of a glass epoxy substrate, a first resin encapsulator mixed with a wavelength-converting material is charged into the reflection frame to seal the light emitting diode element, a second resin encapsulator and a third resin encapsulator used as a surface layer are stacked on an upper portion of the glass epoxy substrate including the reflection frame in layer form to seal the entirety of the first resin encapsulator, and an ultraviolet absorbent is mixed into at least a third resin encapsulator. A wavelength-converting material such as a luminescent material or the like becomes hard to be affected by externally-incoming ultraviolet radiation or the like, whereby the aging of the wavelength-converting material can be controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.