Plasma processing method and apparatus
US6346915B1 · kind B1 · utility
34Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2000 |
| Grant date | Feb 12, 2002 |
| Priority date | — |
| Expiry date | Aug 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/26
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate is processed while plasma distribution on the substrate is controlled by a plasma trap made up of a groove-shaped space between a dielectric plate and a dielectric ring provided around the dielectric plate, and a groove-shaped space between an antenna and a conductor ring provided around the antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.