Solderable thin film
US6347175B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1999 |
| Grant date | Feb 12, 2002 |
| Priority date | — |
| Expiry date | Jul 14, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2217/27
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A copper-gallium alloy is deposited on a nonconductive substrate, such as glass, ceramic, or polymeric material, to provide a conductor to which solder will readily adhere, such that electrical contacts to photonic and electrical components can be made. The copper-gallium thin film can also be used to provide a surface for solder sealing a component within a hermetically sealed enclosure. In a preferred embodiment, the copper-gallium alloy was from about 1 to about 40 percent gallium to about 99 to about 60 percent copper and was deposited to a thickness of from about 400 nanometers to about 3 microns. The copper-gallium film is deposited utilizing sputtering or electron beam deposition equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.