Method of manufacture for embedded processing subsystem module
US6347735B1 · kind B1 · utility
4Cited by
17References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2000 |
| Grant date | Feb 19, 2002 |
| Priority date | — |
| Expiry date | Nov 14, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The inventive embedded processing subsystem module is adapted for backside circuit board assembly directly opposite of a specific microprocessor or Digital Signal Processor so that circuit groups such as memory banks and communications peripherals may utilize otherwise unused backside printed circuit board space underneath the processor device, and further so that high-speed signals interconnecting the processor and subsystem circuit devices traverse a minimized printed circuit track length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.