Dustproof smock for use in a clean room, fabric for use in manufacturing the smock, and method of manufacturing the fabric
US6348116B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1999 |
| Grant date | Feb 19, 2002 |
| Priority date | — |
| Expiry date | Dec 21, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A dustproof fabric for use in manufacturing a smock to be worn in a clean room of a semiconductor fabrication facility includes an inner layer of a knitted fabric, an intermediate layer attached to the inner layer and formed of a non-micro porous polyurethane resin film possessing a high degree of moisture absorbency, and an outer layer attached to the intermediate layer and formed of a high density polyester woven fabric containing conductive yarn in the warp and weft.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.