Patent · US Expired

Dustproof smock for use in a clean room, fabric for use in manufacturing the smock, and method of manufacturing the fabric

US6348116B1 · kind B1 · utility

2Cited by
10References
3Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 21, 1999
Grant dateFeb 19, 2002
Priority date
Expiry dateDec 21, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T442/40
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A dustproof fabric for use in manufacturing a smock to be worn in a clean room of a semiconductor fabrication facility includes an inner layer of a knitted fabric, an intermediate layer attached to the inner layer and formed of a non-micro porous polyurethane resin film possessing a high degree of moisture absorbency, and an outer layer attached to the intermediate layer and formed of a high density polyester woven fabric containing conductive yarn in the warp and weft.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.