Compound waveform gasket for low closure force EMI shielding applications
US6348654B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2000 |
| Grant date | Feb 19, 2002 |
| Priority date | — |
| Expiry date | Oct 12, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S277/92
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resilient EMI shielding and/or environmental sealing gasket for interposition between a first interface surface and an oppositely-disposed second interface surface. The gasket is formed of an elongate body of indefinite length which extends along a longitudinal axis. The body includes base and apex surfaces, and opposing first and second lateral surfaces which extend intermediate the base and apex surfaces. The base surface itself extends along the length the body as configured for proximally supporting the gasket on the first interface surface. The apex surface, in turn, extends radially from the longitudinal axis for distal contact with the second interface surface, and further extends along the longitudinal axis as defining a first waveform profile characterized as having a first periodic series of alternating first high and low amplitude intervals. The second lateral surface also extends along the longitudinal axis as defining a second waveform profile which is disposed generally transverse to the first waveform profile and which is similarly characterized as having a second periodic series of alternating second high and low amplitude intervals. The gasket so formed is deform…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.