Small format optical subassembly
US6349105B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2000 |
| Grant date | Feb 19, 2002 |
| Priority date | — |
| Expiry date | Jul 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has two through-holes formed through a thickness of the non-electrically conductive substrate. The two through-holes are filled with an electrically conductive material so as to form two electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into two regions. The first region has the electrically conductive plating material applied thereto. The first and second through-holes protrudes through the second region. The optical diode has a first lead electrically connected to the first via, and the optical diode has a second lead electrically connected to the second via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.