Spray cooling system
US6349554B2 · kind B2 · utility
65Cited by
14References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2000 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Dec 11, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roll bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.