Layered ultrasonic coupler
US6349599B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2000 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | May 2, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2634
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An ultrasonic coupling assembly includes a barrier layer that contacts the wall, and a generally thicker layer formed of a compliant material such as zinc foil that extends over the first layer. A third layer may cover and enclose the compliant layer, e.g., by folding the first layer over and on top of the second layer to cover the edge faces thereof. An exemplary embodiment is implemented using gold foil approximately one mil thick for the first layer, and zinc sheeting approximately four mils thick for the second layer. Use of inert top and bottom, or outside, layers prevents the inadvertent installation of the coupling element with the compliant layer directly contacting the wall. Disk embodiments may employ a stack of separate disks formed of foils or sheets of the respective materials. For cryogenic applications, a material such as indium may be used for the second layer without risk of its alloying or migration through the first layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.