Curable resin composition
US6350345B1 · kind B1 · utility
19Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2000 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Jun 1, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S528/901
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention has its object to provide a curable resin compositions useful as contact adhesives with a prolonged tack retention period, without affecting the final bond strength. This invention is related to a A curable resin composition which comprises (I) a reactive silicon group-containing polyether oligomer, (II) a copolymer comprising a molecular chain substantially composed of one or more acrylate ester monomer units and/or methacrylate ester monomer units and (III) an accelerator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.