Electrostatically applicable coating powder and processes therefor
US6350495B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2000 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Mar 15, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B41/81
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Hitherto, glazing defects have arisen during glazing of ceramic substrates with an electrostatically applicable coating powder. This problem is solved by the coating powder CPAB and the coating method. The electrostatically applicable coating powder CPAB contains 1 to 50 wt. % of a glass-forming composition A which begins softening at 400 to 750° C. and 99 to 50 wt. % of a glass-forming composition B which begins to soften above 750-1,100° C. Preferably, the coating powder consists of 2.5 to 25 wt. % A, 75 to 97.5 wt. % B and 0 to 20 wt. %, specially 2 to 10 wt. % of thermally or chemically activatable adhesive agents. The coating powder CPAB is electrostatically applied as a single powder. Alternately, coating can be applied in two layers, wherein the CPU powder contains at least 5 wt. % of glass-forming composition A as a lower layer and the powder CPO contains at least 50 wt. % of glass-forming composition B as an upper layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.