Method for attaching a micromechanical sensor in a housing and sensor assembly
US6350630B1 · kind B1 · utility
16Cited by
4References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 7, 1999 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Sep 7, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/0038
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor assembly is formed by attaching a micromechanical semiconductor sensor in a housing. The micro-mechanical sensor is secured to the housing by a gel, which leads to a particularly favorable isolation between the micromechanical sensor and the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.