Compositions with enhanced ductility
US6350804B2 · kind B2 · utility
7Cited by
21References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1999 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Apr 14, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/123
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to compositions comprising an organoclay and polyphenylene ether resin and blends containing polyphenylene ether resin. In a preferred embodiment, the compositions exhibit physical properties that are enhanced over compositions containing clay of the prior art. The invention also relates to methods to enhance the ductility of thermoplastic compositions as compared to compositions containing clay of the prior art. The invention also relates to articles made from the compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.