Patent · US Expired

Electronic device package, and method

US6350954B1 · kind B1 · utility

12Cited by

9References

12Claims

0Family size

Assignee

Motorola, Inc. · US

Inventors

Will Specks · Munich, DE
Nils Bossemeyer · Hersbruck, DE
Mervi Paulasto · Munich, DE

Key dates

Filing date	Jan 24, 2000
Grant date	Feb 26, 2002
Priority date	—
Expiry date	Jan 24, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/16195
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic package (100) has a semiconductor device (130), a two-layer (110, 120) printed circuit substrate (101), and a lead (140) for providing external connections for the package assembly (100). The first layer (110) has an electrical conducting surface structure (112); and the second layer (120) has a recess (125) to receive the device (130). The device frontside (131) is electrically coupled to the conducting surface structure (112) of the first layer (110) in a flip-chip arrangement. The backside (132) of the device (130) is coplanar to the surface (112) of the second layer (120). The lead (140) at least partially overlays the surface (122) of the second layer (120).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.