Multifunction lead frame and integrated circuit package incorporating the same
US6351033B1 · kind B1 · utility
17Cited by
31References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1999 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Oct 6, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/924
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a lead frame for use in packaging a circuit having a discrete component, and a method of manufacture thereof. In one embodiment, the lead frame includes a lead support structure and a plurality of severable leads that are coupled to the lead support structure. The plurality of severable leads extend inward from the lead support structure to predetermined locations corresponding to terminals of the discrete component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.