Packaging and interconnection of contact structure
US6351133B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1999 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Mar 31, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/2414
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A packaging and interconnection for connecting a contact structure to an outer peripheral component. The packaging and interconnection includes a contact structure made of conductive material and formed on a contact substrate, a contact trace horizontally extended on the contact substrate and connected to the contact structure, a contact pad formed on a bottom surface of the contact substrate remote from the contact structure, a contact target provided at an outer periphery of the contact structure in a side-by-side fashion to be electrically connected with the contact pad, a conductive lead for electrically connecting the contact pad and the contact target, an elastomer for achieving flexibility, and a support structure for supporting the contact structure, contact substrate and elastomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.