Patent · US Expired

Separably bondable shunt for wireless suspensions

US6351352B1 · kind B1 · utility

30Cited by
3References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 6, 1999
Grant dateFeb 26, 2002
Priority date
Expiry dateJul 6, 2019

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2203/175
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

The invention provides continuing shunt protection of wireless suspension assemblies with a shunt structure that is readily attached to and detached from the contact pads or other exposed areas of the conductive traces of the flexible conductive laminate portion of the wireless suspension for use as needed to protect the MR and GMR elements/heads. The shunt structure comprises a conductive web to connect the conductive traces in parallel, and adhesive allowing the separable attachment of the web to the traces. The metal or metal deposited conductive web has varying geometries of conductive areas and adhesive areas to allow conductive web attachment to the proximate contact pads of the suspension, to be removed during testing and left on during assembly and between tests to nearly continually protect the head magnetoresistive element, or, to provide continuous ESD protection for the MR and GMR element attached to a flexible conductive circuit, to allow conductive web attachment to the traces beyond the contact pads such that the web is left in place during suspension assembly, during testing and between tests.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.