Heat management system
US6351381B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2001 |
| Grant date | Feb 26, 2002 |
| Priority date | — |
| Expiry date | Jun 20, 2021 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2275/12
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present invention provides a heat management system for controlling the temperature inside of an electronics cabinet. A first heat exchanger is provided that includes a cold plate that is thermally interconnected with the electronic systems and components in the cabinet. A channel is defined in the cold plate that supports a tube having an entrance opening, an exit opening, and is arranged in thermal communication with the electronic systems so as to form a passageway for a liquid coolant fluid to travel through the channel. A second heat exchanger is provided that includes a condenser arranged in fluid flow communication with the entrance opening and the exit opening of the channel and a plurality of fans arranged in confronting relation to the condenser. A third heat exchanger is provided that includes two stacks of substantially parallel plates arranged in two-plate assemblies. Each two-plate assembly has a closed end and an open end such that a closed end of one two-plate assembly is sandwiched between an open end of two adjacent two-plate assemblies. Two fans are provided, one fan arranged so as to blow air onto a portion of the electronics and another fan arranged so as t…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.