Method for applying a microsystem or a converter on a substrate, and device manufactured accordingly

US6351390B1 · kind B1 · utility

Assignee

• Laboratorium fur Physikalische Elektronik Institut fur Quantenelektronik · CH

Inventors

• Felix Mayer · Männedorf, CH
• Oliver Paul · Freiburg im Breisgau, DE

Key dates

• Filing date: Jul 22, 1999
• Grant date: Feb 26, 2002
• Expiry date: Jul 22, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15151
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A process is given for permitting the application to a substrate (2) of a microsystem or transducer (1) having a first partial surface (13), whose interaction with the environment is to be possible, and a second partial surface (14), which is to be protected against external influences. The substrate (2) is prepared, a passage point (20) being produced in said substrate (2). The microsystem (1) and substrate (2) are so mutually positioned that the first partial surface (13) faces the substrate (2) and that the passage point (20) in the substrate (2) and the first partial surface (13) come to rest opposite one another. Contacts (50, 51.1, 51.2) are produced by flip-chip technology. A sealing contact (51.1, 51.2) seals the second partial surface (14) against external influences. A gap (3) between the microsystem (1) and substrate (2) is filled with a filling material (30). A selective cover (24) over the passage point (20) keeps undesired external influences away from the first partial surface (13). The microsystem (1) can e.g. contain a sensor, the first partial surface (13) containing the sensitive surface and the second partial surface (14) electronic functional units.