Thermoelectric cooling device using heat pipe for conducting and radiating
US6351951B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Nov 17, 2000 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Nov 17, 2020 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2210/02
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermoelectric cooling device using heat pipes for heat conducting and dispersing, comprising a multi-bundle of the heat pipe conducting plates installed at the cold end of the thermoelectric cooling member and converged to condenser, a multi-bundle of the heat pipe heat exchangers installed at the hot end of the thermoelectric cooling member with fin plates or fin stripes and converged to the evaporator. It performs a fast cooling and heat dispersing by heat pipes and high efficient phase change and heat transport of the working medium. It can eliminate the heat exchange produced by the heat accumulation on the cold and hot ends, so as to run at the minimum operation temperature differences in order to obtain the maximum cooling capacity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.