Ingot support device for slicing silicon
US6352072B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2001 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Jul 25, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1355
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An ingot support device for slicing silicon is produced by molding a molding material obtained by blending an acrylic resin or an unsaturated polyester resin and one or more inorganic fillers selected from the group consisting of aluminum hydroxide, barium sulphate, barium carbonate, calcium carbonate and silica. According to the present invention, there is provided an ingot support device for slicing silicon which can be produced easily at a low cost, which has enough strength to cope with the upsizing of the ingot block, has high adhesive properties with the ingot block, and has other further improved properties which are required of the ingot support device for slicing silicon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.