Soldering device

US6352190B1 · kind B1 · utility

Assignee

• Messer Griesheim GmbH · DE

Inventors

• Heinz-Olaf Lucht · Krefeld, DE
• Tilman Schwinn · Krefeld, DE
• Hans-Peter Schmidt · Echterdingen, DE
• Jens Tauchmann · Berlin, DE

Key dates

• Filing date: May 1, 2000
• Grant date: Mar 5, 2002
• Expiry date: May 1, 2020

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K2101/42
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A soldering apparatus has a solder container and a casing to accommodate a protective-gas atmosphere for soldering printed circuit boards. During transport of the circuit boards through a casing the circuit boards are brought into contact with a solder wave in the container. The casing has an inlet for printed circuit board on an inlet side and an outlet on its outlet side. In addition, the casing has a supply of non-oxidizing gas and an arrangement for admitting gas into the casing. The casing is designed as a modular construction kit having subassemblies and/or constructional elements which comprise an input tunnel, an entry tunnel, at least two covering elements, an outlet tunnel and a detachable connection on the solder container and/or the sub-assemblies and/or constructional elements to connect the sub-assemblies and/or constructional elements and the solder container.