Method of forming an electronic package with a solder seal
US6352195B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2000 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Sep 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.