Automated semiconductor identification system
US6352203B1 · kind B1 · utility
4Cited by
21References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1999 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Mar 17, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus is used to identify the type of microprocessor assembly mounted on a printed circuit board. A heat sink is coupled to the microprocessor assembly, and a label is coupled to the heat sink. The label has one of a plurality of preselected patterns of optically reflective and non-reflective areas formed thereon, and at least one photodetector is positioned adjacent the microprocessor assembly on the printed circuit board for detecting the preselected pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.