Solder ball terminal
US6352437B1 · kind B1 · utility
43Cited by
16References
2Claims
0Family size
Inventor
Key dates
| Filing date | Oct 20, 1999 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Oct 20, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A solder ball terminal includes a body portion, a spherical socket disposed at one end of the body portion, the spherical socket including an interior wall terminating in an annular lip, wherein the annular lip defines an opening of the spherical socket and a solder ball disposed within the socket such that a portion of the solder ball extends through the opening and beyond the annular lip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.