Semiconductor copper band pad surface protection
US6352743B1 · kind B1 · utility
4Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 1999 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Jun 11, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/976
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible during ball or wedge wire bonding to obtain metal-to-metal contact between the bonding surfaces and the wires bonded thereto. Coated semiconductor wafers are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.