Curable slurry for forming ceramic microstructures on a substrate using a mold

US6352763B1 · kind B1 · utility

Assignee

• 3M INNOVATIVE PROPERTIES COMPANY · US

Inventors

• Kenneth R. Dillon · White Bear Lake, US
• Kyung H. Moh · Woodbury, US
• Thomas E. Wood · Windom, US
• Raymond C. Chiu · Woodbury, US
• Vincent W. King · Woodbury, US
• Richard P. Rusin · Woodbury, US
• Timothy L. Hoopman · River Falls, US
• Paul E. Humpal · Stillwater, US

Key dates

• Filing date: Dec 23, 1998
• Grant date: Mar 5, 2002
• Expiry date: Dec 23, 2018

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31612
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.