Poly(phenylene ether)-polyvinyl thermosetting resin
US6352782B1 · kind B1 · utility
79Cited by
33References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1999 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Dec 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.