Patent · US Expired

Integrated semiconductor optic sensor device and corresponding manufacturing process

US6352876B1 · kind B1 · utility

28Cited by
3References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 27, 2000
Grant dateMar 5, 2002
Priority date
Expiry dateJul 27, 2020

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10F39/1825

Abstract

The invention relates to a process for manufacturing a light sensor device in a standard CMOS process, including, implanting active areas on a semiconductor substrate to obtain a first integrated region of a corresponding photosensor; and forming a stack of layers having different thickness and refractive index layers over the photosensor to provide interferential filters for the same photosensor. At least one of the above mentioned layers is formed by a transparent metallic oxide having a high refraction index and a corresponding high dielectric constant. In this manner, due to the transparency of the high refraction index material, the design of interferential resonators is rendered more flexible making possible the use of a stack of layers including more than one high refraction index layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.