Rework method for wafers that trigger WCVD backside alarm
US6352924B1 · kind B1 · utility
3Cited by
18References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2000 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Jun 5, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A new method is provided to replace tungsten plugs for wafers that trigger the WCVD backside alarm. In this new rework process, the original TiN glue layer is sputter etched back and a new (“fresh”) 100-Angstrom thick layer of TiN is deposited. The new tungsten plug is created over the top surface of the refreshed glue layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.