Temperature processing module
US6353209B1 · kind B1 · utility
38Cited by
10References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1999 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Dec 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/75745
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A module for thermally processing a substrate has a plurality of thermally-conductive heating elements supported in position within a plane. Resistive heaters in the form of cartridge heaters are in thermal contact with the heating elements. Multiple zones are enabled by physical separation of the heating elements that constitute the thermal processing plate. A cooling plate is positioned in proximity to the backside of the heating elements and can be driven into thermal contact with the upper heated plate when cooing is desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.