Structure for mounting radiating plate
US6353537B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 15, 1999 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Dec 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A radiating-plate mounting structure for mounting a radiating plate on a semiconductor integrated circuit installed on a printed circuit board is arranged to have a pin disposed on the printed circuit board in the neighborhood of the semiconductor integrated circuit and to fix the radiating plate to the semiconductor integrated circuit by pressing the radiating plate with a spring member using a lock part of the pin as a fulcrum. At this time, the middle part of the radiating plate can be reliably fixed to the semiconductor integrated circuit by a hole provided in the spring member for allowing a fin part of the radiating plate to escape through the hole. The structural arrangement effectively eliminates the possibility of having the radiating plate caused to peel off by some impact inflicted thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.