Method of making mechanical-laser structure
US6353999B1 · kind B1 · utility
124Cited by
5References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 6, 1999 |
| Grant date | Mar 12, 2002 |
| Priority date | — |
| Expiry date | May 6, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mechanical-laser structure on a printed circuit board and a carrier. A method for fabricating the mechanical-laser structure includes the following steps. A substrate is provided. A first through hole is formed in the substrate by mechanical drilling. An epoxy plug is formed within the first through hole. A conductive layer is formed on the substrate by compression. The conductive layer is patterned to form conducting wires and exposes the epoxy plug. A micro via is formed within the epoxy plug by laser drilling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.