Apparatus and method for connecting a plurality of electrical circuits borne upon a plurality of substrates
US6354845B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2000 |
| Grant date | Mar 12, 2002 |
| Priority date | — |
| Expiry date | Jun 1, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10909
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for connecting a plurality of electrical circuits borne upon a plurality of substrates is disclosed. A first substrate of the plurality of substrates has a first aperture having a first diametral displacement and a first inner wall. A portion of the first inner wall is electrically connected with a first circuit borne upon the first substrate. The apparatus comprises a sheet of electrically conductive material arranged to a displacement from an axis in a substantially helical orientation about the axis. The material has a spring characteristic when the helical orientation establishes the displacement at a spring displacement. The spring characteristic urges the conductive material to a greater displacement from the axis than the spring displacement and permits insertion of the apparatus in the first aperture. The spring characteristic and the first diametral dimension cooperate to seat the apparatus in the first aperture to establish electrical connection with the first circuit. The method comprises the steps of: (a) spirally winding a sheet of electrically conductive material to an insertion diametral displacement generally equal to or slightly greater than the first …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.