Polishing composition
US6355075B1 · kind B1 · utility
35Cited by
7References
13Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 11, 2000 |
| Grant date | Mar 12, 2002 |
| Priority date | — |
| Expiry date | Feb 11, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition comprising an abrasive, an anticorrosive, an oxidizing agent, an acid, a pH regulator and water and having a pH within a range of from 2 to 5, wherein the abrasive is colloidal silica or fumed silica, and its primary particle size is at most 20 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.