Patent · US Expired

Support structure

US6355363B1 · kind B1 · utility

2Cited by

4References

8Claims

0Family size

Assignee

W. C. Hereaus GmbH & Co. KG · DE

Inventors

Gunter Herklotz · Bruchköbel, DE
Frank Krüger · Könnern, DE
Thomas Frey · Brighton, US
Thomas Giesel · Niederrodenbach, DE

Key dates

Filing date	Feb 16, 2000
Grant date	Mar 12, 2002
Priority date	—
Expiry date	Feb 16, 2020

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/12951
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A support structure is provided for holding open lumina, the support structure having a stainless steel substrate and a platinum layer forming the surface of the structure. The structure has at least one gold layer arranged between the substrate and the platinum layer. The platinum layer is preferably applied with a pulsed current with current reversal, in order to avoid or reduce brittleness occurring by absorption of hydrogen during galvanic deposition of platinum. Such a support structure (stent) substantially withstands the high mechanical stresses, particularly bending and torsional forces that occur during application, without the formation of significant tears in the platinum layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.