Means for sealing an electronic or optical component within an enclosure housing
US6355881B1 · kind B1 · utility
16Cited by
13References
7Claims
0Family size
Inventors
Key dates
| Filing date | May 5, 1997 |
| Grant date | Mar 12, 2002 |
| Priority date | — |
| Expiry date | May 11, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package assembly consisting of an electronic and/or optical component mounted on a circuit board and sealed to a housing, the housing having a hole therethrough to provide access to the component and being filled with an organic encapsulant material, the seal surrounding the access hole to prevent flow of the encapsulant material therethrough, wherein the seal consists of an integral sealing member having an aperture therethrough in alignment with the access hole and being prepared from a gel-type material, the preferred gel-type material being a silicone and/or fluorosilicone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.