Microelectronic integrated sensor

US6355964B1 · kind B1 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Karlheinz Mueller · Friedrichshafen, DE
• Stefan Kolb · Unterschleißheim, DE

Key dates

• Filing date: Jul 28, 2000
• Grant date: Mar 12, 2002
• Expiry date: Jul 28, 2020

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2203/053
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A microelectronic integrated sensor is formed with a cantilever. For the purpose of ensuring a system which is especially invulnerable to mechanical strains during production, the cantilever is placed freely movably on a support, and motion limiters are provided on the edge. The invention also provides for the formation of nitride pillars for supporting the upper layers, in order to further increase the stability. A corresponding production process for producing the sensor is disclosed as well.