Current monitor system and a method for manufacturing it
US6356068B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 1999 |
| Grant date | Mar 12, 2002 |
| Priority date | — |
| Expiry date | May 12, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R15/202
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A fully packaged current monitor system for galvanically isolated current measurement is manufactured in line with commercial IC fabrication and LOC packaging technology. A current path is part of the lead frame on which a die with sensor means is mounted with the aid of an electrically insulating correspondingly pre-patterned glue tape, the structured surface of the die facing the lead frame. The system manufactured in this way achieves for currents up to +/−10 A, a system accuracy of better than 50 mA and is applicable for currents up to the order of 50 A. The system performance can be further improved by ferromagnetic field concentrators and on-chip compensation techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.